ABOUT
Heterogeneous System Integration
Task 4.1
Dynamic Multi-Domain Multi-Hierarchy Power Management
Task Lead: Cheng Huang, Other PIs: Alyosha Molnar
OBJECTIVE
This task will develop a hierarchical power system to deliver current to A2I&C
engine and 3D multi-spectral pixel array. The voltage regulation module on the interposer will be
co designed with compact, on-chip, and in-pixel low dropout regulators.
Deliverable. Circuit techniques and silicon measurement of multi-domain power management.
Task 4.2
2.5D/3D Technologies for Sensor Integration
Task Lead: Muhannad Bakir, Other PIs: James Buckwalter
OBJECTIVE
The objectives of this task are to 1) develop novel 3D heterogeneous integration technologies for ultra-low power, chip-scale form factor, and high-performance multi-spectral sensor systems and 2) utilize the developed technologies to prototype center-level 3D stacked multi-spectral sensors using devices and circuits developed across the center. Deliverable. Experimental demonstration of 3D multi-spectral array and 2.5D CogniSense sensor.
Task 4.3
ML-Assisted AMS Simulation of Sensor
Inna Partin-Vaisband, Other PIs: Pamela Abshire, Mingoo Seok
OBJECTIVE
The objective of this task is to develop a machine learning based framework for accurate simulation of large-scale 3D integrated AMS systems and apply to CogniSense sensor. Deliverable. Algorithms for 3D AMS simulations and results on CogniSense sensor.