Task 4.1: Dynamic Multi-Domain Multi-Hierarchy Power Management
Supporting the diverse supply needs for different blocks:
– Functional (V, I, P, tunability, accuracy, dynamic speed, etc.)
– Efficient
– Fast
– Integrable
Achievements
Task: 4.2 2.5D/3D Technologies for Sensor Integration
Objective
Design and demonstrate a 3D heterogeneous integration technology specific for chip-scale and high-performance multi-spectral sensor system accounting thermal, electrical, fabrication and assembly constraints.
Comparison to SOTA Package Architectures
Electrical Feedthrough Within Thermal Bridge
Technical Approach – Glass Substrate
Take Aways
•Demonstrated single-layer glass package with initial design rules
•Need Cu interconnect for sub-0.1 dB loss in vertical transitions
•Need low-temperature bonding to enable low-loss dielectric
Task: 4.3 ML-Assisted AMS Simulation of Sensor
Objective
State-of-the-art and Limitations
•No robust RF simulators for computationally-efficient package-aware DSE and optimization
Package simulators
•Simulation with traditional FEM-based methods (e.g., Ansys) is computationally prohibitive
•Existing SOTA analytical models are limited
•Oversimplified single signal-ground pair
•Key parasitics are neglected
•Transverse modes are assumed
Accelerated AMS design/simulation
•DSE with SPICE methods is computationally prohibitive
•Existing SOTA ML frameworks are limited
•No sizing-based DSE
•PVT variations are not simultaneously considered
Artifacts Generated from the Task
•Utilized for predicting impact of packaging on the overall power efficiency of the CogniSense sensor
•Started a collaboration with Tingyi Gu to accelerate the design and simulation of an integrated MIMO LiDAR system
