Oral Presentations
Session I
1. Introductions – Madhavan Swaminathan, PRC Director
2. Welcome Address from IEN – Professor Oliver Brand, IEN Director
3. PRC: State of the Center & Path Forward – Madhavan Swaminathan, PRC Director
4. Keynote Address: System level Optimization for Datacenter Applications – Packaging and Test Implications – Ravi Agarwal, Facebook
Ravi Agarwal received PhD dual major in Materials Science & Engineering and Polymer Science from North Carolina State University and MBA from University of California Berkeley. Ravi has 16+ years of High Tech industry experience in the areas of advanced packaging, supply chain strategy, product management, and business operations. He has co-authored more than 20 journal and conference publications, and holds 6 U.S. patents. Ravi is a technical sourcing manager at Facebook Infrastructure group. In this role, he is responsible for driving advanced packaging for both networking and AI/ML compute applications to meet Facebook future workloads. He is driving Chiplet Business workstream in Open Domain-Specific Architecture (ODSA) Sub-Project within Open Compute Project (OCP) working with ecosystem partners to enable Chiplet marketplace.
Session II
Design for AI & HPC Systems
5. Glass Interposer Integration of Logic and Memory Chiplets: PPA Benefits Over Other Means – Sungkyu Lim, Professor, ECE
6. Industry Feedback
- Moderators: Krishna Bharath (Intel) & Youichirou Satou (AGC)
- AM Recording
- PM Recording
Session III
Process for High Density Interposers</3>
7. Advanced Processes and Characterization Methods for High Density Interconnect 2.5D and 3D Glass Packaging – Mohan Kathaperumal, Senior Research Engineer, PRC
8. Day 1 Wrap Up – Madhavan Swaminathan, PRC Director
End of Day 1
Session III (cont’d)
9. Industry Feedback
- Moderators: Steven Verhaverbeke (AMAT) & Takenori Kakutani (Taiyo)
- AM Recording
- PM Recording
Session IV
Industry Panel
10. PRC Collaboration Model & Success Stories: Industry Panel – Moderator: Madhavan Swaminathan, PRC Director
Panelists
Danny Lohan – Toyota – Danny Lohan is a scientist at the Toyota Research Institute of North America (TRI-NA). He graduated with his BS (’14), MS(‘16), and PhD(’19) from the University of Illinois at Urbana-Champaign. His research focus was on numerical design optimization methods for thermal management. He also led a startup company, Hinetics, to execute two small business innovation research (SBIR) grants to develop novel electric machine technology to promote carbon reduction (’18-’19). He has been with Toyota since 2019 working in the electronics research department developing thermal management solutions for next generation electrified vehicles.
Andrew Ketterson – Qorvo – Andrew is currently a Qorvo Research Fellow in the area of compound semiconductors and advanced RF packaging. In addition, he is leading the Advanced Technology portion of the Navy-sponsored State-of-the-art Heterogenous Integration Packaging (SHIP) center recently created at Qorvo’s Texas factory to develop next-generation mmWave packages for the DoD community. Andrew also manages the R&D Process Architecture group within Qorvo’s Infrastructure and Defense business unit. He has previously held positions at TriQuint Semiconductor as the Lithography Section Head and as a Senior Member of the Technical staff developing III-V RF and photonic devices. He began his career at Texas Instrument’s Central Research Labs as a Member of the Technical staff developing GaAs-based RF devices. Andrew graduated with a doctorate electrical engineering from the Univ. of Illinois at Urbana-Champaign.
Bai Nei – Intel – Bai is currently a R&D engineer in Substrate Packaging TD at Intel. Bai received his Ph.D. in Physics from Michigan State University in 2014, and focused on ultrafast laser development and applications. Since joining Intel in 2015, Bai has been driving the advancements in patterning and scaling capability for advanced packaging.
Martin Letz – Schott – Martin Letz works with SCHOTT, a special glass company, as a senior principal scientist in the material development. He joined SCHOTT in 2001 and was involved in several projects regarding materials for semiconductor structuring. Since several years he focusses on glasses and glass ceramics for electronic applications and their properties. One focus is on materials for antenna and filter structures for wireless data transfer. A second focus is on miniaturization of high frequency electronics. Prior to that he received his PhD in solid state physics from the University of Stuttgart in Germany and had several positions in research institutions and Universities (Tartu University (Estonia), Max-Planck Institute (Stuttgart, Germany), Queens University (Kingston, Canada), University of Mainz (Germany)) working on different aspects of strong correlations in condensed matter.
Session V
Power Delivery, Distribution & Thermal for Computing & Automotive
11. Advances in Power Electronics Packaging: IVRs and SiC-based Motor Drives – Vanessa Smet, Assistant Professor, ME
12. Industry Feedback
- Moderators: Michael Guyenot (Bosch) & Bidyut Bhattacharyya (PRC)
- AM Recording
Session VI
Materials & Assembly
13. Materials Research at PRC for Package Interconnects and Reliability – Jack Moon, Research Engineer, PRC
14. Industry Feedback
- Moderators: Doug Sheldon (JPL) & K.C. Yee (TSMC)
- AM Recording
- PM Recording
15. Day 2 Wrap Up – Madhavan Swaminathan, PRC Director
End of Day 2
Session VII
Wireless Technologies for 5G & 6G
- Moderators: Andrew Ketterson (Qorvo) & Nikita Ambasana (PRC)
- AM Recording
Session VIII
Industry Panel
18. Challenges and Opportunities for Glass Interposer – What are the showstoppers for HVM?
Panelists
Jun-Ro Yoon – Corning – Dr. Yoon is a Through Glass Via (TGV) Program manager at Corning. He received his Ph. D in Materials Science & Engineering from The Ohio State University in 2012. After joining Corning, he was responsible for developing new Biz. opportunities, particularly for SEMICON and next-generation display. Since 2014, he has participated in TGV projects and has been focusing on delivering TGV to the market.
Kaysar Rahim – Northrop Grumman – Kaysar Rahim is a Technical Fellow at Northrop Grumman Corporation. With over 12 years in semiconductor industries, Kaysar has experience in advanced packaging design, integration, assembly and manufacturing, product execution, team building, strategic implementation, and cross-functional collaboration. Prior to joining Northrop Grumman Corporation, Kaysar was a lead 3D packaging integration engineer for GlobalFoundries and was responsible for 2.5D/3D advanced nodes (7nm & 14nm) microprocessor package development. Previous to his work at GlobalFoundries, Kaysar was the lead wafer level packaging engineer at Maxim Integrated (Previously Dallas Semiconductor). Kaysar earned his PhD in Mechanical Engineering from Auburn University. Kaysar currently holds 11 United States patents. He also authored 35+ technical papers and journals including several best papers awards at ECTC and iMAPS conferences.
Steve Hillerich – Samtec – Steve Hillerich is a Mechanical Engineer and MBA who’s been with Samtec for 22 years. After designing automation for connector and cable assemblies, Steve migrated into helping customers solve their tricky custom applications. As Samtec has become a technology leader in this space, Steve has helped find and integrate new technologies within the broad Samtec portfolio. The tip of the spear for Samtec is Glass Core Technology and Steve is helping productize define the roadmap, and listen to customer needs for these new and exciting products.
Srinivas (Srini) Pietambaram – Intel – Srinivas Pietambaram is a technologist in the substrate TD module engineering organization in ATTD and is responsible for pathfinding and development of next generation Intel package substrates. He started as a packaging R&D Engineer in 2012 and has since been developing several industry first process technologies and disruptive architectures that are enabling advanced package substrates needed for future Intel products. Prior to joining Intel, he spent over 10 years making key contributions which led to a successful commercialization of MRAM, a non-volatile memory technology at Motorola/Freescale/Everspin Technologies. Srini has authored over 100 filed patent applications in the area of packaging and memory technologies. Srini received his Ph.D. in Materials Science & Engineering from the University of Florida and a bachelor’s degree from National Institute of Technology, Rourkela in India.
Tobias Gotschke – Schott – Tobias Gotschke works with SCHOTT, a specialty glass company, as a senior project manager in the corporate division New Ventures. He joined SCHOTT in 2019 and since then is driving the business development for specialty glass in the advanced packaging industry. In his former career in the LED industry, he gathered a lot of experience in managing larger project portfolios and supply chains as well as driving critical production ramp-ups and development projects in Europe and Asia. In his academic career, he received a PhD in physics from the Humboldt University Berlin (Berlin, Germany) and was working at several universities and research institutes (Technical University Berlin (Berlin, Germany), RWTH Aachen (Aachen, Germany), Research Center Juelich (Juelich, Germany), Paul-Drude-Institute (Berlin, Germany)) in the field of semiconductor nanotechnologies.
19. Live Polling & Feedback
Student Presentations
Session II: Design for AI & HPC Systems
1. Majid Ahadi – Invertible Neural Networks for Inverse Design of CTLE in High-speed Channels
2. Eric Huang – Spherical Harmonic based RCS Compression through Anisotropic Point Scatterer Model
3. Mercy Daniel Aguebor – Design of Interposer for high performance applications
4. Venkatesh Avula – Package-integrated Thermal Management for Embedded Passives
5. Seunghyup Han – PDN Optimization with Power Supply Noise Reduction
6. Osama Bhatti – Design Space Exploration using Neural Networks
7. Rakesh Krishna – Photonic Interconnect architectures for HPC applications
Student Poster Session Q&A
Session III: Process for High Density Interposers
8. Siddharth Ravichandran – Demonstrations of 2D & 3D Glass Panel Embedding (GPE) for HPC/AI applications
9. Pratik Nimbalkar – 1-micron Redistribution Layers : Design for Mechanical Reliability
10. Omkar Gupte – Socketable BGAs by surface modification of solder spheres with multi-layered metallic coatings
11. Christopher Blancher – Eight Metal Layer Glass Interposer Test Vehicle
12. Pragna Bhaskar – Reliability aspects of ultra low K dielectric materials
Student Poster Session Q&A
Session V: Power Delivery, Distribution & Thermal for Computing & Automotive
13. Claudio Alvarez – Family of Compact Toroidal Embedded Inductor for Low and High Frequency IVRs – Design, Demonstration, and Characterization
14. Prahalad Murali – Embedded Magnetic Core Inductors – Materials & Processes
15. Ryan Wong – Advanced Packages and Materials for Next-Generation Automotive Voltage Source Inverter (VSI)
16. Mete Muslu – Vertically-Integrated Power Delivery and Thermal Management in SiC Drive Inverter Packages
Student Poster Session Q&A
Session VI: Materials & Assembly
17. Ramon Sosa – Cu pillars with nanoporous-Cu caps for C2S Cu-Cu bonding
18. Zhijian Sun – Materials Engineering for Die Attach Film with High Thermal Conductivity
19. Jiaxiong Li – High Performance Epoxy Molding Compound for Power Packaging
20. Trilochan Rambhatla and Amiri Savage – Thermo-Mechanical Reliability of Flip-Chip on Glass for Space Applications
Student Poster Session Q&A
Session VII: Wireless Technologies for 5G & 6G
21. Nahid Aslani Amoli – First Demonstration of Ultra-miniaturized, High-performance Filters on Alumina Ribbon Ceramic Substrates for 5G Applications
22. Sridhar Sivapurapu – Flex on Glass for mmWave Applications
23. Lakshmi Narasimha Vijaykumar – Design and modelling of RF wireless interconnects and slot antennas using Substrate Integrated Waveguides (SIW)
24. Yuqi Liu – Design of Glass Substrate Antenna for mm-Wave 5G Transceiver Array on Glass
25. Kai-Qi Huang – Antenna in Package for Next-Generation Communications
Student Poster Session Q&A
26. Mutee Ur Rehman – First Demonstration of Glass Based Interconnects in D-band for mmWave Applications
27. Serhat Erdogan – Design and Fabrication of Glass-Based Antennas for Handset Packages in D-band
28. Nithin Nedumthakady – Design, Fabrication, and Characterization of High-Performance Cu-Gr Heat Spreaders for Reliable Thermal Management of Embedded Dies
29. Xiaofan Jia – Dielectric Waveguide on Glass and Chip Embedding Technology for D-Band Wireless Communication
30. Lydia Mele – Vapor Chamber Design and Fabrication for 5G and 6G mmWave Applications
Student Poster Session Q&A