Device Fabrication Cleanroom
- 28,500 ft2 space
- >200 individual tools
- Two-day short course offered by IEN
- CMOS fabrication, MEMS, micro/nanoelectronics, materials research & photonics w/ ~6” wafer
Bio-Device Cleanroom
- Class 1000 cleanroom
- Bio-safety level II lab
- Contamination-free bio-related fabrication
- Manufacture with printing of nanomaterials and biomaterials & materials characterization
Material Characterization Facility
- Atomic-level ordering to the collective behavior of molecules, compounds, & crystals to the macroscopic behavior of bulk solids and structures
- Surface science & molecular property measurement
- SEM, XRD, TEM, FIB, XPS, …
Flip Chip Bonding
Flip chip assembly employing various bonding methods with fine pitch interconnections, moderate heating rates, and tight planarity control
Wire Bonding Lab
High-power devices, MEMS devices, packaging of sensitive electronics for consolidation into larger systems and test fixtures
Soft Packaging and System Integration
Hard-soft materials integration, soft packaging, nanostructured sensors, flexible electronics, and integration of bio-degradable materials
Electrical Characterization
Computation modeling capability to design flexible and stretchable electronics
