Publications

Publications

Journal Publication

Year 2024

  1. Lee, P.-C., McLeod, A. J., Choi, M., Vaca, D., Contreras Mora, D., Wang, K., Yun, S., Dutta, J., Pal, D., Kumar, S., and Kummel, A. C. “ACS Applied Materials & Interfaces,” 2024, 16 (20), 26664-26673.

Year 2023

  1. Barry, M. C., Gissinger, J. R., Chandross, M., Wise, K. E., Kalidindi, S. R., and Kumar, S. “Voxelized Atomic Structure Framework for Materials Design and Discovery,” Computational Materials Science, Volume 230, 2023, 112431, ISSN 0927-0256.
  2. Tikadar, A., & Kumar, S. (2023). Machine learning approach to predict heat transfer and fluid flow characteristics of integrated pin fin-metal foam heat sink. Numerical Heat Transfer, Part B: Fundamentals, 1–26.
  3. Barry, M.C., Kumar, S., Kalidindi, S.R. (2023). Voxelized Representations of Atomic Systems for Machine Learning Applications. In: Qu, C., Liu, H. (eds) Machine Learning in Molecular Sciences. Challenges and Advances in Computational Chemistry and Physics, vol 36. Springer, Cham.
  4. Tadepalli, R. B., and Kumar, S. “Numerical Analysis of Oscillating Heat Pipes for High Heat Flux Applications,” AIAA 2023-3916. AIAA AVIATION 2023 Forum. June 2023.
  5. Shen, W., Vaca, D., Gibson, G., and Kumar, S. “Temperature Dependent Thermal Properties of Thin Film Hafnium Oxide,” 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, USA, 2023, pp. 1-6,
  6. Athena, F. F., Nnaji, M., Vaca, D., Tian, M., Buchmaier, W., Aabrar, K. A., Graham, S., Datta, S., Kumar, S., Vogel, E. M., MAX Phase Ti2AlN for HfO2 Memristors with Ultra-Low Reset Current Density and Large On/Off Ratio. Adv. Funct. Mater. 2024, 2316290.

Year 2022

  1. Barry, M.C., Kumar, N., and Kumar, S., “Boltzmann Transport Equation For Thermal Transport in Electronic Materials And Devices,” Annual Review of Heat Transfer, 24, pages 131-172, 2022.
  2. Sequeira, S., Bennion, K., Cousineau, J. E., Narumanchi, S., Moreno, G., Kumar, S., and Joshi, Y., “Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model.” ASME. Journal of Electronic Packaging, 144(2), 021114, 2022. 
  3. Kumar, S., “Security Keys From Paired Up Nanotube Devices,” Nature Electronics, 5, pages 412-413, 2022.
  4. Vaca, D., Barry, M.C., Yates, L., Nepal, N., Katzer, D.C., Downey, B.P., Wheeler, V., Nyakiti, L., Meyer D.J., Graham, S., and Kumar S., “Measurements and Numerical Calculations of Thermal Conductivity to Evaluate the Quality of β-Gallium oxide Thin Films Grown on Sapphire and Silicon Carbide by Molecular Beam Epitaxy,” Applied Physics Letters, 121, 042107, 2022.
  5. Tikadar, A., and Kumar, S., “Local Hotspot Thermal Management Using Metal Foam Integrated Heat Sink,” Applied Thermal Engineering, 221, 229632, 2022
  6. Tikadar, A., and Kumar, S., “Investigation of Thermal-Hydraulic Performance of Metal-Foam Heat Sink Using Machine Learning Approach,” International Journal of Heat and Mass Transfer, 199, 123438, 2022.
  7. Guo, L., Sheng, Q., Kumar, S., Zhigang, L., and Guihua, T., “Lubricant-Induced Tunability of Self-Driving Nanodroplets on Conical Grooves,” Journal of Molecular Liquids, 373, 2022.

Year 2021

  1. Guo, L., Shen, W., Kumar, S., Liu, Z., Tang, G., “Lubricant-enhanced self-transport of condensed nanodroplets trapped in Wenzel state,” Journal of Molecular Liquids, 2021.
  2. Kumar, N., Barry, M.C., Kumar, S., “Thermal transport in beta-gallium oxide thin-film using non-gray Boltzmann transport equations,” Journal of Physics: Condensed Matter, 2021.
  3. Tikadar, A., Kim, J.W., Joshi, Y., Kumar, S., “Flow Assisted Evaporative Cooling for Electric Motor,” IEEE Transactions on Transportation Electrification, 2021. 
  4. Guo, L., Kumar, S., Yang, M., Tang, G., Liu, Z., “Role of the microridges on cactus spines,” Nanoscale, 2021. 
  5. Montgomery, R., H., Zhang, Y., Yuan, C., Kim, S., Shi, J., Itoh, T., Mauze, A., Kumar, S., Speck, J., and Graham, S., “Thermal Management Strategies for a Gallium Oxide Vertical Trench-Fin MOSFETs,” Journal of Applied Physics, (accepted, Feb 2021). 
  6. Shen, W., Kumar, S., and Kumar, S., “Experimentally Calibrated Electro-thermal Modeling of Temperature Dynamics in Memristors,” Applied Physics Letters, 118, 2021, doi: 10.1063/5.0039797 
  7. Tikadar, A., Johnston, D., Kumar, N., Joshi, J., and Kumar, S., “Comparison of Electro-Thermal Performance of Advanced Cooling Techniques for Electric Vehicle Motors,” Applied Thermal Engineering, 183(2), 116182, 2021. 

Year 2020

  1. Shen, W., and Kumar, S., “Reconsidering Uncertainty from FDTR Measurement and Novel Data Analysis by Deep Learning,” Nanoscale and Microscale Thermophysical Engineering, Published online: 19 Aug 2020, (https://doi.org/10.1080/15567265.2020.1807662) 
  2. Nepal, N., Katzer, D.S., Downey, B.P., Wheeler, V.D., Nyakiti, L.O., Storm, D.F., Hardy, M.T., Freitas, J.A., Jin, E.N., Vaca, D., Yates, L., Graham, S., Kumar, S., and Meyer, D.J., “Heteroepitaxial growth of β-Ga2O3 films on SiC via molecular beam epitaxy,” Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 38 (6), 063406, 2020. 
  3. Barry, M., Wise, K., Kalidindi, S. and Kumar, S., “Voxelized Atomic Structure Potentials: Predicting Atomic Forces with the Accuracy of Quantum Mechanics Using Convolutional Neural Networks,” The Journal of Physical Chemistry Letters, 11, 21, 9093–9099, 2020. 
  4. Guo, L., Tang, G., and Kumar, S., “Dynamic Wettability on the Lubricant-Impregnated Surface: from Nucleation to Growth and Coalescence,” ACS Applied Materials and Interfaces, 12 (23), 26555-26565, 2020.
  5. Chen, J., Mishra, S., Vaca, D., Kumar, N., Yeo, W.H., Sitaraman, S., and Kumar, S., “Thin Dielectric Layer Enabled Low Voltage Operation of Fully Printed Flexible Carbon Nanotube Thin Film Transistors,” Nanotechnology, 31 235301, 2020. 
  6. Kumar, N., Vaca, D., Joishi, C., Xia, Z., Rajan, S., and Kumar, S., “Ultrafast Thermoreflectance Imaging and Electrothermal Modeling of β-Ga₂O₃ MESFETs,” IEEE Electron Device Letters, 41 (4), 641 – 644, 2020.
  7. Liang, D., Roshan-Zamir, A., Fan, Y. H., Zhang, C., Wang, B., Descos, A., Shen, W., Yu, K., Li, C., Fan, G., Kurczveil, G., Hu, Y., Huang, Z., Fiorentino, M., Kumar, S., Palermo, S. M., and Beausoleil, R. G., “Fully-Integrated Heterogeneous DML Transmitters For High-Performance Computing,” IEEE/OSA Journal of Lightwave Technology, 2020 (in print). 

Year 2019

  1. Chen, J., Mishra, S., Vaca, D., Kumar, N., Yeo, W.H., Sitaraman, S., and Kumar, S., “Thin Dielectric Layer Enabled Low Voltage Operation of Fully Printed Flexible Carbon Nanotube Thin Film Transistors,” Nanotechnology, (accepted), 2019. 
  2. Brown, D. B., Bougher, T. L., Zhang, X., Ajayan, P. M., Cola, B. A., and Kumar, S., Thermal Boundary Conductance and Phonon Transmission in Hexagonal Boron Nitride/Graphene Heterostructures,” Phys. Status Solidi A, 1900446, 216 (23), 2019. 
  3. Guo, L., Tang, G., and Kumar, S., “Droplet Morphology and Mobility on Lubricant-Impregnated Surfaces: A Molecular Dynamics Study,” Langmuir, 35 (49), 16377, 2019.
  4. Kumar, N., Chen, J., Xia, Z., Rajan, S., and Kumar, S., “Electrothermal Characteristics of Delta-Doped β-Ga₂O₃ Metal-Semiconductor Field-Effect Transistors,” IEEE Transactions on Electron Devices, 66 (12), 5360, 2019. 
  5. Brown, D. B., Shen, W., Li, X., Kai, X., Geohegan, D. B., and Kumar, S., “Spatial Mapping of Thermal Boundary Conductance at Metal-Molybdenum Diselenide Interfaces,” ACS Applied Materials and Interfaces, 11 (15), 14418–14426, 2019. 
  6. Chen, J., Lotfi, A., Hesketh, P., and Kumar, S., “Carbon nanotube thin-film-transistors for gas identification,” Sensors and Actuators B: Chemical, 281, 1080-1087, 2019. 

Year 2018

  1. Yan, Z., and Kumar, S., “Phonon mode contributions to thermal conductivity of pristine and defective β-Ga2O3,” Physical Chemistry Chemical Physics, 46, 2018. 
  2. Barry, M. C., Yan, Z., Yoon, M., Kalidindi, S.R., and Kumar, S., “Phonon transport properties of two-dimensional electride Ca2N–A first-principles study,” Applied Physics Letters, 113(13), 131902, 2018. 
  3. Brown, D. B., Bougher, T. L., Cola, B. A., Kumar, S., “Oxidation limited thermal boundary conductance at metal-graphene interface,” Carbon, 139, 913-921, 2018. 
  4. Gonzalez-Valle, C. U., Kumar, S., and Ramos-Alvarado, B., “Thermal Transport across SiC–Water Interfaces,” ACS Applied Materials & Interfaces 10 (34), 29179-29186, 2018.
  5. Gupta, M. P., Kumar, N., and Kumar, S., “Computational Study of Thermal Transport in Nanowire-Graphene Thin Films,” Nanotechnology, 17 (4), 829, 2018. 
  6. Kumar, N., Chen, J., Kar, M., Sitaraman, S. K., Mukhopadhyay, S. and Kumar, S., “Multi-gated Carbon Nanotube Field Effect Transistors based Physically Unclonable Functions as Security Keys,” IEEE Internet of Things Journal, 2018 (doi: 10.1109/JIOT.2018.2838580).
  7. Yan, Z., Yoon, M., and Kumar, S., “Influence of defects and doping on phonon transport properties of monolayer MoSe2,” 2D Materials, 5 (3), 031008, 2018. 
  8. Gonzalez-Valle, C. U., Kumar, S., and Ramos-Alvarado, B., “Investigation on the Wetting Behavior of 3C-SiC Surfaces: Theory and Modeling,” The Journal of Physical Chemistry C, 122 (13), 7179-7186, 2018. 
  9. Chen, J. and Kumar, S., “Variability in Output Characteristics of Single-Walled Carbon Nanotube Thin-Film Transistors,” IEEE Transactions on Nanotechnology, 17 (2), 353-361, 2018. 
  10. Shen, W., Kumari, N., Gibson, G., Jeon, Y., Henze, D., Silverthorn, S., Bash, C., and Kumar, S., “Effect of annealing on structural changes and oxygen diffusion in amorphous HfO2 using classical molecular dynamics,” Journal of Applied Physics 123, 085113 (2018) 
  11. Yarali, M., Brahmi, H., Yan, Z., Li, X., Xie, L., Chen, S., Kumar, S., Yoon, M., Xiao, K., and Mavrokefalos, A., “The Effect of Metal Doping and Vacancies on the Thermal Conductivity of Monolayer Molybdenum Diselenide,” ACS Applied Materials & Interfaces 2018 10 (5), 4921-4928. 

Year 2017

  1. Ramos-Alvarado, B., and Kumar, S., “Spectral Analysis of the Heat Flow Across Crystalline and Amorphous Si–Water Interfaces,” The Journal of Physical Chemistry C, 2017, 121 (21), pp 11380–11389.
  2. Chen, L., Yan, Z., and Kumar, S., ‘Coupled Electron-Phonon Transport and Heat Transfer Pathways in Graphene Nanostructures’, Carbon, 2017, 123, pp. 525-535. 
  3. Gupta, M., Vallabhaneni A., and Kumar, S., “Self-Consistent Electro-Thermal Modeling of Passive and Microchannel Cooling in AlGaN/GaN HEMTs, IEEE Transactions on CPMT, 2017, 7 (8), 1305-1312.
  4. Vallabhaneni A., Chen L., Gupta M., and Kumar S., “Solving Non-Gray Boltzmann Transport Equation in Gallium Nitride,” Journal of Heat Transfer, 2017, 139 (10), 102701. 
  5. Barabadi, B., Kumar, S, and Joshi, Y. K., “Transient Heat Conduction in On-Chip Interconnect Using Proper Orthogonal Decomposition Method,” Journal of Heat Transfer, Jan. 2017 (doi:10.1115/1.4035889). 

Year 2016

  1. Gupta, M., and Kumar, S., “Numerical study of electrical transport in co-percolative metal nanowire-graphene thin-films.” Journal of Applied Physics 120.17 (2016): 175106.
  2. Yan, Z., Chen, L., Yoon, M., and Kumar, S. “The Role of Interfacial Electronic Properties on Phonon Transport in Two-Dimensional MoS2 on Metal Substrates,” ACS Applied Materials & Interfaces, 8 (48), 33299–33306, 2016. 
  3. Ramos-Alvarado, B., Kumar, S., Peterson, G. P., “Solid–Liquid Thermal Transport and Its Relationship with Wettability and the Interfacial Liquid Structure”, The Journal of Physical Chemistry Letters, 7, 3497–3501, 2016. 
  4. Huang H., Chen L., Varshney V., Roy A., Kumar, S. “Investigation of Phonon Transport and Thermal Boundary Conductance at the Interface of Functionalized SWCNT and Poly (ether-ketone)”, Journal of Applied Physics, 120, 095102, 2016. 
  5. Ramos-Alvarado, B., Kumar, S., Peterson, G. P., “Wettability transparency and the quasiuniversal relationship between hydrodynamic slip and contact angle”, Applied Physics Letters,2016.
  6. Yan, Z., Chen, L., Yoon, M., Kumar, S.. “Phonon Transport at the Interfaces of Vertically Stacked Graphene and Hexagonal Boron Nitride Heterostructures.” Nanoscale, 2016, 8, 4037-4046
  7. Ramos-Alvarado, B., Kumar, S., Peterson, G. P., “The hydrodynamic slip length as a surface property”, Physical Review E 93, 023101, 2016. 
  8. Ramos-Alvarado, B., Kumar, S., Peterson, G. P., “On the wettability transparency of graphene-coated silicon surface”, The Journal of Chemical Physics 144(1), 014701, 2016. 

Year 2015

  1. Chen L., Wang X., and Kumar S., “Thermal Transport in Fullerene Derivatives Using Molecular Dynamics Simulations,” Scientific Reports, 5, 2015. 
  2. Lee K., Brown D., and Kumar S., “Silicon Nanowire Arrays Based On-Chip Thermoelectric Generators,” IEEE Transactions Components on Packaging and Manufacturing Technology, 5(8),2015. 
  3. Joshi, Y.; Yalamanchili, S.; Kumar, S.; Ghosh, R.; Barabadi, B., “Thermal Simulations in Support of Mulit-scale Co-design of Energy Efficient Information Technology Systems”, International Journal of Numerical Methods for Heat and Fluid Flow, 2015. 
  4. Matthew, R., and Kumar, S., “Optimization of Thermoelectric Coolers for Hotspot Cooling in 3D Stacked Chips,” ASME Journal of Electronic Packaging, 137, 011006, 2015. 
  5. Ramos-Alvarado, B., Kumar, S., Peterson, G. P., “Wettability of graphitic-carbon and silicon surfaces: MD modeling and theoretical analysis”, The Journal of Chemical Physics, 143, 044703, 2015. 
  6. Barabadi, B., Kumar, S., Sukharev, V., Joshi, Y., “Multiscale Transient Thermal Analysis of Microelectronics”, Journal of Electronic Packaging, 137, 031002-1, 2015.

Year 2014

  1. Chen, L., Huang, Z., and Kumar, S., “Impact of Bonding at Multi-layer Graphene/metal Interfaces on Thermal Boundary Conductance.” RSC Advances, 4(68), 2014.
  2. Sullivan, O., Gupta, M., Mukhopadhyay, S., Kumar, S., “On-Chip Power Generation Using Ultrathin Thermoelectric Generators,” ASME Journal of Electronic Packaging, 137 (1), 011005, 2014.
  3. Chen, X., Donmezer, F., Kumar, S., and Graham, S., “A Numerical Study on Comparing the Active and Passive Cooling of AlGaN/GaN HEMTs, IEEE Transactions on Electron Devices, 61, 12, 2014.
  4. Sadasivam, S., Che, Y., Huang, Z., Liang, C., Kumar, S., and Fisher, T. S., “The Atomistic Green’s Function Method for Interfacial Phonon Transport,” Annual Review of Heat Transfer, 17, 89-145, 2014,(Invited)
  5. Chen, L., and Kumar, S., “Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate,” Journal of Heat Transfer, 136(5), 052401 2014.
  6. Salazar, P. F., Kumar, S., and Cola, B. A., “Design and optimization of thermo- electrochemical cells,” J. Appl. Electrochem., 44 (2), 325-336, 2014.

Year 2013

  1. Liang, C., Huang, Z., and Kumar, S., “Phonon Transmission and Thermal Conductance across Graphene/Cu Interface,” Applied Physics Letters, 103, 123110, 2013. 
  2. Gupta, M. P., Behnam, A., Lian, F., Estrada, D., Pop, E., and Kumar, S., “High Field Breakdown Characteristics of Carbon Nanotube Thin Film Transistors,” Nanotechnology, 24, 405204, 2013. 
  3. Alexandrov, B., Sullivan, O., Kumar, S., and Mukhopadhyay, S., “Control Principles and On-chip Circuits for Active Cooling using Integrated Super Lattice Based Thin-Film Thermoelectric Devices,” IEEE Transaction on VLSI System, 2013. 
  4. Sullivan, O., Alexandrov, B., Mukhopadhyay, S., and Kumar, S., “3D Compact Model of Packaged Thermoelectric Coolers,” ASME Journal of Electronic Packaging, 135, 031006, 2013. 
  5. Matthew, R., Manickaraj, K., Sullivan, O., Mukhopadhyay, S. and Kumar, S., “Hotspot Cooling in Stacked Chips using Thermoelectric Coolers,” IEEE Transactions on Components and Packaging Technologies, 3 (5), 759-767, 2013. 
  6. Cho, M., Kersey, C., Gupta, M. P., Sathe, N., Kumar, S., Yalamanchili, S., and Mukhopadhyay, S., “Power Multiplexing for Thermal Field Management in Many Core Processors,” IEEE Transactions on Components and Packaging Technologies, 3(1), 94-104, 2013.

Year 2012

  1. Gupta, M. P., Liang, C., Estrada, D., Behnam, A., Pop, E., and Kumar, S.., “Impact of Thermal Boundary Conductances on Power Dissipation and Electrical Breakdown of Carbon Nanotube Network Transistors,” Journal of Applied Physics, 112, 124506, 2012
  2. Barabadi, B., Joshi, Y. K., Kumar, S., and Ahmed, G. R., “Interconnect Joule Heating Under Transient Currents Using Transmission Line Method,” ASME Journal of Electronic Packaging, 134, 011009, 2012. 
  3. Gupta, M. P., Cho, M., Mukhopadhyay, S., and Kumar, S., “Thermal Investigation into Power Multiplexing for Homogeneous Many-Core Processors,” Journal of Heat Transfer, 134, 061401, 2012. 
  4. Sullivan, O., Gupta, M. P., Mukhopadhyay, S., and Kumar, S., “Array of Thermoelectric Coolers for On-Chip Thermal Management,” ASME Journal of Electronic Packaging, 134, 021005, 2012. (Invited) 
  5. Salazar, P. F., Kumar, S., and Cola, B. A., “Nitrogen- and Boron-Doped Carbon Nanotube Electrodes in a Thermo-Electrochemical Cell,” Journal of Electrochemical Society, 159 (5), B483-B488, 2012. 
  6. Chatterjee S., Salahuddin S., Kumar S., and Mukhopadhyay S., “Impact of Self-Heating on Reliability of Spin-Torque-Transfer RAM Cell,” IEEE Transactions of Electron Devices,  59 (3), 791-799, 2012.  

Year 2011

  1. Liang, C., and Kumar, S., “Thermal Transport in Double-Wall Carbon Nanotubes using Heat Pulse,” Journal of Applied Physics, 110, 074305, 2011.
  2. Gupta, M. P., Sayer, M., Mukhopadhyay, S., and Kumar, S., “Ultrathin Thermoelectric Devices for On-Chip Peltier Cooling,” IEEE Transactions on Components and Packaging Technologies, 1 (9), 1395-1405, 2011.
  3. Kumar, S., Cola, B. A., Jackson, R. and Graham S., Carbon Nanotubes: A Review of Electronic, Thermal and Optical Aspects, ASME Journal of Electronic Packaging, 133 (2), 020906, 2011. (Invited)
  4. Kumar, S., N. Pimparkar, Murthy, J. Y., and Alam, M. A. Self-consistent Electrothermal Analysis of Nanotube Network Transistors, Journal of Applied Physics, 109, 014315, 2011.

Before Year 2009

  1. Kumar, S., and Murthy, J. Y., Interfacial Thermal Transport between Nanotubes, Journal of Applied Physics, 106, 084302, 2009. [JAP]
  2. Kumar, S., Murthy, J. Y., and Alam, M. A., Electrical and Thermal Transport in Thin Film Nanotube Composites with Applications to Macro-Electronics, International Journal of Nanomanufacturing, 2 (3), 2008. (Invited)
  3. Kumar, S., Alam, M. A., and Murthy, J. Y., Effect of Percolation on Thermal Transport in Nanotube Composites, Applied Physics Letters, 90, 104105, 2007.
  4. Kumar, S., Alam, M. A., and Murthy, J. Y., Computational Model for Transport in Nano-tube Based Composite with Applications to Flexible Electronics, Journal of Heat Transfer, 129, 500-508, 2007.
  5. Pimparkar, N., Kumar, S., Cao, Q., Murthy, J. Y., Rogers, J. A., and Alam, M. A., Current-Voltage Characteristics of Long-Channel Nanobundle Thin-Film Transistors: A Bottom-up Perspective, Electron Device Letters, 28, 157-160, 2007.
  6. Kumar, S., Acharya, S., Deposition of Particles on Ocular Tissues and the Formation of Krukenberg Spindle, Hyphema and Hypopyon, ASME Journal of Biomechanical Engineering, 129, 174-186, April 2007.
  7. Kumar, S., Acharya, S., Beuerman, R., and Palkama, A., Numerical Solution of Ocular Fluid Dynamics in a Rabbit Eye: Parametric Effects, Annals of Biomedical Engineering, 34 (3), 530-533, March 2006.
  8. Kumar, S., Pimparkar, N., Murthy, J. Y., and Alam, M. A., Theory of Transfer Characteristics of Nanotube Network Transistors, Applied Physics Letters, 88, 123505, March 2006.
  9. Alam, M. A., Pimparkar, N., Kumar, S., and Murthy, J. Y., Theory of Nanocomposite Network transistors for Macroelectronics Applications, MRS Bulletin, 466-470, 31, June 2006.
  10. Kumar, S., Murthy, J. Y., and Alam, M. A., Performance of Carbon Nanotube-Dispersed Thin-Film Transistors, Applied Physics Letters, 89, 143501, 2006.
  11. Kumar, S., and Murthy, J. Y., A Numerical Technique for Computing Effective Thermal Conductivity of Fluid-Particle Mixtures, Numerical Heat Transfer B, 47, 552-572, 2005.
  12. Kumar, S., Murthy, J. Y., and Alam, M. A., Percolating Conduction in Finite Nano-tube Networks, Physical Review Letters, 95, 066802, August 2005.

Conference Publications (Referred)

  1. Tikadar, A., Kumar, N., Joshi, Y., and Kumar, S., “Coupled Electro-Thermal Analysis of Permanent Magnet Synchronous Motor for Electric Vehicles,” The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, May 26-May 29, 2020, Orlando, FL, USA.
  2. Vaca, D., Yates, L., Nepal, N., Katzer, D. S., Downey, B. P., Wheeler, V., Meyer, D. J., Graham, S., and Kumar, S., “Thermal Conductivity of β-Ga2O3 Thin Films Grown by Molecular Beam Epitaxy,” ITherm, 2020, May 26-May 29, 2020, Orlando, FL, USA.
  3. Sequeira, S., Bennion, K., Cousineau, J.E., Narumanchi, S., Moreno, G., Kumar, S., and Joshi, Y., “Validation and Parametric Investigations of an Internal Permanent Motor using a Lumped Thermal Parameter Model,” International Electronic Packaging Technical Conference and Exhibition (InterPACK), Virtual Conference, Oct. 27-29, 2020.
  4. Tikadar, A., Shambhavi, Kumar, N., Ehizibolo, J., Joshi, Y., and Kumar, S., “Parametric Study of Thermal Performance of BMW i3 Electric Motor,” ISER International Conference on Heat Transfer and Fluid Flow (ICHTFF-2019), Singapore, 20th-21st December, 2019.
  5. Kumar, N., Chen, J., Xia, Z., Rajan, S., and Kumar, S., “Electro-thermal Simulation of Delta-doped β-Ga2O3 Field Effect Transistors,” ITherm, 2019, May 28-May 31, Las Vegas, CA USA.
  6. Chen, J., Xia Z., Rajan S., and Kumar S., “Analysis of Thermal Characteristics of Gallium Oxide Field-Effect-Transistors.” The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), IEEE, 2018.
  7. Brown, D. B., Li, X., Xiao, K., Geohegan, D. B., and Kumar, S., “Thermal Boundary Conductance Mapping at Metal-MoSe2 Interface,” ITherm, 2018. (Outstanding Paper Award in Emerging Technologies and Fundamentals Track)
  8. Liang, D., Zhang, C., Roshan-Zamir, A., Yu, K., Li, C., Kurczveil, G., Hu, Y., Shen, W., Fiorentino, M., Kumar, S., Palermo, A., and Beausoleil, R., “A Fully-integrated Multi-λ Hybrid DML Transmitter,” Optical Fiber Communications Conference and Exposition (OFC), 2018.
  9. Yan, Z., Yoon M., and Kumar S., “A first-principles study of phonon transport properties of monolayer MoSe 2.” Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th IEEE Intersociety Conference on. IEEE, 2017.
  10. Gupta, M., Vallabhaneni A., and Kumar, S., “A self-consistent reduced order model for current and temperature in GaN HEMTs.” Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th IEEE Intersociety Conference on. IEEE, 2017.
  11. Vallabhaneni A., Gupta, M., and Kumar, S., “Thermal transport in high electron mobility transistors: A Boltzmann transport equation study.” Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th IEEE Intersociety Conference on. IEEE, 2017.
  12. Mok S., Joshi Y. K., Kumar S., and Hutchins, R. R., “Impact of a Rotary Regenerative Heat Exchanger on Energy Efficiency of an Air Cooled Data Center”, IEEE Thermal and Thermo-mechanical Phenomena in Electronics Systems (ITHERM), May 31 – June 3, 2016, Las Vegas, NV, USA.
  13. Vallabhaneni A., Gupta M., and Kumar S., “Effect of Ballistic Thermal Transport in High Electron Mobility Transistors”, ITHERM, May 31 – June 3, 2016, Las Vegas, NV, USA.
  14. Huang, H.X., Kumar, S., Varsheney, V., Roy, A.”Investigation of Phonon Transport and Thermal Boundary Conductance at Interface of Functionalized SWCNT and Poly (Ether-Ketone)” Third International Conference on Computational Methods for Thermal Problems, ThermaComp2016, July 6-8, 2016, Atlanta, USA.
  15. Mok S., Joshi Y. K., Kumar S., and Hutchins, R. R., “Energy Simulation of Data Centers with Hybrid Liquid/Air Cooling and Waste Heat Re-Use,” IMECE, Nov 11-17, 2016, Phoenix, Arizona, USA.
  16. Chen, L., and Kumar, S., “Electron-Phonon Transport in Graphene Devices ,” CHT-15, the 6th International Symposium on Advances in Computational Heat Transfer, July 2015, Rutgers University, Piscataway, NJ, USA.
  17. Banerjee, S., Gupta, M., Kumar, S., Chatterjee, A.,“Digitally-Compatible Ring Oscillator Frequency Driven Tuning of CN-TFT Amplifiers: Performance Compensation Under Statistical and Morphological Variations”, IEEE International Mixed-Signal Test Workshop 2015, Paris, France.
  18. Brown, D. B., Bougher, T. L., Cola, B. A., and Kumar, S., “Thermal boundary conductance at metal-graphene-metal interfaces using time-domain thermoreflectance method,” ASME InterPACKICNMM, July 6-9, 2015, San Francisco, CA, USA.
  19. Lee, K. Y., Brown, D., and Kumar, S., “Performance Evaluation of Silicon Nanowire Arrays Based Thermoelectric Generators,” IEEE Thermal and Thermo-mechanical Phenomena in Electronics Systems (ITHERM), May 27-30, 2014, Orlando, FL, USA
  20. Gupta, M., Behnam, A., Estrada, D., Pop, E., Kumar, S., “High Field Breakdown of Carbon Nanotube Network Transistors”, ASME InterPACK, Burlingame, CA, July 2013
  21. Gupta, M., Kumar, S., “Dissipative Particle Dynamics Study of Liquid Crystals under Electric Field”, ASME MNHMT 2013, Hongkong, China
  22. Barabadi, B., Joshi, Y. K., and Kumar, S., “Rapid Multiscale Transient Thermal Modeling of Packaged Microprocessors Using Hybrid Approach,” 14th Electronics Packaging Technology Conference (EPTC), December 5-7, 2012, Resort Worlds Sentosa, Singapore. (Invited)
  23. Liang, C., and Kumar, S., “Heat Dissipation Mechanism at Supported CNT-CNT Junctions,” ASME Summer Heat Transfer Conference, July 8-12, 2012, Rio Grande, Puerto Rico.
  24. Sullivan, O., Mukhopadhyay, S., and Kumar, S., “Thermoelectric Generators Embedded in Microelectronic Chip,” ASME International Mechanical Engineering Congress & Exposition (IMECE), November 9-15, 2012, Houston, TX, USA.
  25. Barabadi, B., Kumar, S., Sukharev, V., and Joshi, Y. K., “Multi-scale Transient Thermal Analysis of Microelectronics,” IMECE, November 9-15, 2012, Houston, TX, USA.
  26. Liang, C., and Kumar, S., “Thermal Transport in Graphene Supported on Copper,” 3rd Micro-Nanoscale Heat and Mass Transfer International Conference (MNHMT), March 3-6, 2012, Atlanta, GA, USA.
  27. Gupta, M. P., Estrada, D., Pop, E., and Kumar, S., “Impact of Contact Resistances on Electrical and Thermal Transport in Carbon Nanotube Network Transistors,” MNHMT, March 3-6, 2012, Atlanta, GA, USA.
  28. Barabadi, B., Kumar, S, and Joshi, Y. K., “Transient Thermal Analysis of Three-dimensional Interconnect Structures Using Proper Orthogonal Decomposition Method,” MNHMT, March 3-6, 2012, Atlanta, GA, USA.
  29. Alexandrov, B., Sullivan, O., Kumar, S., and Mukhopadhyay, S., “Prospects of Active Cooling with Integrated Super-Lattice based Thin-Film Thermoelectric Devices for Mitigating Hotspot Challenges in Microprocessors,” 17th Asia and South Pacific Design Automation Conference, January 30- February 2, 2012, Sydney, Australia.
  30. Matthew, R., Manickaraj, K., Sullivan, O., and Kumar, S., “Thermoelectric Coolers for Hostspot Thermal Management of 3D Stacked Chips,” ASME International Mechanical Engineering Congress & Exposition (IMECE), November 11-17, 2011, Denver, CO, USA.
  31. Sullivan, O., Alexandrov, B., Mukhopadhyay, S., and Kumar, S., “Compact Model of Thermoelectric Coolers on a Micro-electronic Chip,” IMECE, November 11-17, 2011, Denver, CO, USA. Gupta, M. P., Cho, M., Mukhopadhyay, S., and Kumar, S., An Investigation into Power Migration Policies in Many-Core Processors to Manage On-chip Thermal Profile, InterPACK, July 6-8, 2011, Portland, Oregon, USA.
  32. Barabadi, B., Joshi, Y. K., and Kumar, S, Prediction of Transient Thermal Behavior of Planar Interconnect Architecture using Proper Orthogonal Decomposition Method,InterPACK, July 6-8, 2011, Portland, Oregon, USA.
  33. Barabadi, B., Joshi, Y. K., and Kumar, S, Characterization of Steady and Transient Heating of Interconnects- A Review, IRPS, April, 2011, Austin, Texas, USA.
  34. Cho, M., Sathe, N., Gupta, M., Kumar, S., Yalamanchilli, S. and Mukhopadhyay, S.,Proactive Power Migration to Reduce Maximum Value and Spatiotemporal Non-uniformity of On-chip Temperature Distribution in Homogeneous Many-Core Processors, SEMITHERM 2010, February 21-25, 2010, Santa Clara, CA  USA.
  35. Gupta, M. P., Cho, M., Mukhopadhyay, S., and Kumar, S., Thermal Management of Multicore Processors using Power Multiplexing, ITHERM, June 2-5, 2010, Las Vegas, Nevada, USA.
  36. Gupta, M. P., Sayer, M. S., Mukhopadhyay, S., and Kumar, S., On-chip Peltier Cooling using Current Pulse, ITHERM, June 2-5, 2010, Las Vegas, Nevada, USA.
  37. Barabadi, B., Joshi, Y. K., Kumar, S., and Ahmed,G. R., Thermal Characterization of Planar Interconnect Architectures under Different Rapid Transient Currents using the Line Matrix and Finite Element Methods, ITHERM, June 2-5, 2010, Las Vegas, Nevada, USA.
  38. Chatterjee S., Salahuddin S., Kumar S., and Mukhopadhyay S., Analysis of Thermal Behaviors of Spin-Torque-Transfer RAM: A Simulation Study, International Symposium on Low Power Electronics and Design (ISLPED), August 18-20, 2010, Austin, Texas, USA.
  39. Sullivan, O., Gupta, M., Mukhopadhyay, S., and Kumar, S., Thermoelectric Coolers for Thermal Gradient Management on Chip, ASME International Mechanical Engineering Congress & Exposition (IMECE), November 12-18, 2010, Vancouver, Canada.
  40. Liang, C., and Kumar, S., Heat Pulse Analysis in Single-Wall and Double-Wall Carbon Nanotubes, ASME International Mechanical Engineering Congress & Exposition (IMECE), November 12-18, 2010, Vancouver, Canada.
  41. Kumar, S., and Murthy, J. Y., Interfacial Thermal Transport between Nanotubes, ASME Summer Heat Transfer conference, July 19-23, 2009, San Francisco, California, USA.
  42. Barabadi, B., Joshi, Y. K., Kumar, S., and Ahmed,G. R., Thermal Characterization of Planar Interconnect Architectures under Transient Currents, ASME International Mechanical Engineering Congress and Exposition, November 17-21, 2009, Lake Buena Vista, Florida, USA.
  43. Chatterjee S., Salahuddin S., Kumar S., and Mukhopadhyay S., Modeling of the Self-Heating in STTRAM and Analysis of its Impact on Reliable Memory Operations, NVMTS 2009, Portland, Oregon, Oct. 25-28.
  44. Kumar, S., Alam, M. A., and Murthy, J. Y., Percolation effects on the thermal conductivity of 3D Nanotube Composites, ASME International Mechanical Engineering Congress and Exposition, October 31-November 6, 2008, Boston, Massachusetts, USA.
  45. Kumar, S., Joshi, R. V., Chuang, C. T., Keunwoo, K., and Murthy, J. Y., Leakage Analysis for FinFet Devices using Self-Consistent Electro-Thermal Modeling, ICICDT, May 30 – June 1, 2007, Austin, Texas, USA.
  46. Kumar, S., Alam, M. A., and Murthy, J. Y., Numerical Model for Thermal Transport in 3D Nanotube Composites, InterPACK, July 8-12, 2007, Vancouver, British Columbia, CANADA.
  47. Alam, M. A., Pimparkar, N., Kumar, S., and Murthy, J. Y., Percolation and Fractal Geometry: How Spatial Inhomogeneity is Reshaping Modern Semiconductor Devices, Device Research Conference, Notre Dame, Indiana, June 20-22, 2007.
  48. Kumar, S., Joshi, R. V., Chuang, C. T., Keunwoo, K., and Murthy, J. Y., Schonenberg, K. T., and Nowak, E. J., Self-Consistent and Efficient Electro-Thermal Analysis for Poly/Metal Gate FinFets, IEDM, December 11-13, 2006, San Francisco, California, USA.
  49. Kumar, S., Alam, M. A., and Murthy, J. Y., Computational Thermal Model for Nanotube Based Electronic Display, ITHERM, May 30-June 2, 2006, San Diego, California, USA.
  50. Alam, M. A., Pimparkar, N., Kumar, S., and Murthy, J. Y., The Short and Long Channel Pick-up Stick Transistors: A Promising Technology for Micro- and Macro-Electronics, ISDRS, December 2005.
  51. Kumar, S., Alam, M. A., and Murthy, J. Y., Thermal Transport in Nanotube Composites for Large-Area Macroelectronics, Proceedings of HT, ASME Summer Heat Transfer conference, July 17-22, 2005, San Francisco, California, USA.
  52. Kumar, S., Acharya, S., Numerical Solution of Iridectomy for Surgical Treatment of Glaucoma, Proceedings of NHTC, ASME Summer Heat Transfer conference, July 11-15, 2004, Charlotte, North Carolina, USA.
  53. Kumar, S., Murthy, J. Y., A Numerical Technique for Computing Effective Thermal Conductivity of Fluid-Particle Mixtures, Proceedings of IMECE, ASME International Mechanical Engineering Conference, Nov. 13-19, 2004, Anaheim, California, USA.
  54. Kumar, S., Alam, M. A., and Murthy, J. Y., Simulation of Thermal Transport in Nano-wire Composites for Macro-Electronics Applications, Proceedings of Integrated Nanosystems, ASME Conference, September 22-24, 2004, Pasadena, California, USA.
  55. Kumar, S., Acharya, S., Prediction of Particle Deposition on Ocular Tissues and the Formation of Krukenberg Spindle, Hyphema and Hypopyon, Proceedings of IMECE,ASME International Mechanical Engineering Conference, November 13-19, 2004, Anaheim, California, USA.
  56. Kumar, S., Acharya, S., Beuerman, R., and Palkama, A., Numerical Solution of Ocular Fluid Dynamics in Rabbit Eye, Proceedings of NHTC, ASME Summer Heat Transfer conference, July 21-23, 2003, Las Vegas, California, USA