May 23-24, 2023
Georgia Institute of Technology, Atlanta, GA
Glass panel packaging promises to address a variety of strategic needs: a) In HPC for higher performance, lower cost and improved reliability; b) In automotive for improved high temperature reliability; c) In wireless for 6G for integrated antennas; d) In consumer electronics for ultra-miniaturization and lower cost. To enable all these, a global manufacturing ecosystem needs to be set up from R&D to manufacturing to enable the above products and applications.
The most leading-edge packaging currently is wafer-based Silicon BEOL packaging. It has been in use for more than a decade. Wafer-based Silicon packaging has a massive manufacturing infrastructure and provides the highest IO density but is limited by high cost for emerging large packages. In addition, it requires four levels of packaging. It is expected, however, to be improved further with hybrid bonding and a combination of 2.5 and 3D architectures.
Glass packaging has shown promise to address these limitations, based on a decade-long R&D at Georgia Tech and its industry partners. These R&D activities led to the demonstration of industry’s 1st panel scalable RDL to 1 micron. However, panel manufacturing infrastructure doesn’t fully exist. Design and architectures have not been explored.
|Plenary Session||Venky Sundaram (3D System Scaling), Siddharth Ravichandran (Chipletz)|
|Electrical & Mechanical Design of Glass Substrates||Siddharth Ravichandran (Chipletz), Suresh Sitaraman (Georgia Tech)|
|Glass Panel: Core & TGV Technologies||Martin Letz (Schott), Jobert van Eisden (Atotech)|
|Panel-scale RDL Materials & Processes||Habib Hichri (Ajinomoto USA), Venky Sundaram (3D System Scaling)|
|Chip- & Board-level Assembly||Vanessa Smet (Georgia Tech), Steffen Kroehnert (ESPAT)|
|Co-packaged Optics on Glass||Junro Yoon (Corning), Vivek Raghunathan (Xscape Photonics)|
|Glass Panel Manufacturing Infrastructure||Sung Jin Kim (Absolics), Kuldip Johal (Atotech)|
|Panel: Glass Panel History & Market Status||Jan Vardaman (TechSearch International)|