Oral Presentations
Session 1
1. Introductions – Madhavan Swaminathan, PRC Director
2. Welcome Address from Georgia Tech – Professor Chaouki Abdallah, EVPR
3. Welcome Address from IEN – Professor Oliver Brand, IEN Director
- Recording– Presentations 1, 2, & 3
4. PRC Overview – Madhavan Swaminathan, PRC Director
5. Keynote Address: Scaling for Heterogeneous Integration – Dr. Ravi Mahajan, Intel Fellow
Session 2
AI/HPC – Part I
6. Heterogeneous Integration for AI Applications: Status & Challenges – Siddarth Ravichandran, PhD Student
7. RDL & Microvia Processes for Glass Based Packaging – Mohan Kathaperumal, Sr. Research Engineer
8. Industry Feedback
Session 3
AI/HPC – Part 2
9. Power Delivery for using IVR with Embedded Inductors – Claudio Alvarez, PhD Student
10. Day 1 Wrap Up – Madhavan Swaminathan, PRC Director
End of Day 1
11. Reliability Considerations for Next-Generation Microelectronic Packaging Systems – Suresh Sitaraman, Professor
12. Industry Feedback
Session 4: Industry
13. Industry Panel – Moderator: Madhavan Swaminathan, PRC Director
Session 5: Power Electronics
14. Advanced Power Electronics for Automotive Drivetrains – Vanessa Smet, Assistant Professor
15. Day 2 Wrap Up – Madhavan Swaminathan, PRC Director
End of Day 2
16. Industry Feeback
Session 6: 5G and 6G
17. Madhavan Swaminathan: Wireless for 5G and 6G Applications
18. Flex on Glass for mmWave – Sridhar Sivapurapu, PhD Student
19. Industry Feedback
20. CLOSING REMARKS – Madhavan Swaminathan, PRC Director
Student Presentations
AI/HPC
Design
1. Hakki Torun: High-Speed Bus Physical Design Analysis through Machine Learning
2. Majid Ahadi: High-Speed Channels Analysis and Design with Machine Learning
3. Eric Huang: RCS Modeling for High Performance Computing
4. Mercy Daniel Aguebor: Interposer Optimization for High Performance Computing
Student Poster Session 1 Q&A
5. Siddharth Ravichandran: 2.5D and 3D Glass Panel Embedding for High-Performance Computing
Process
6. Bartlet Deprospo: 1 Micron and Beyond RDL
7. Pratik Nimbalkar: Modeling and Simulation of Mechanical Reliability of Fine Line RDL
8. Omkar Gupte: Socketable BGAs by Surface Modification of Solder Spheres with Multilayered Metallic Coatings
Student Poster Session 2 Q&A
9. Ramon Sosa: Cu pillars with Nanoporous-Cu caps for C2S Cu-Cu Bonding
10. Christopher Blancher: Design of 8 Metal Layer Glass Interposer Test Vehicle with Stacked Vias
11. Pragna Bhaskar: Reliability Aspects of RDL
Power Delivery
12. Claudio Alvarez: Embedded Toroidal Inductors for High-Frequency 48V to 1V & 12V to 1V Integrated Voltage Regulator
13. Venkatesh Avula: Package-integrated Thermal Management for Embedded Passives
Student Poster Session 3 Q&A
14. Seunghyup Han: PDN Optimization with Power Supply Noise Reduction
15. Osama Bhatti: Design Space Exploration using Neural Networks
16. Prahalad Murali, Embedded Magnetic Core Inductors – Materials & Processes
Emerging Technologies
17. Zhijian Sun, Materials Engineering for Die Attach Film with High Thermal Conductivity
18. Rakesh Krishna V: Optical coupling design for high-speed photonic interconnects
19. Rui Zhang: Fabrication and Characterization of < 2 micron microvias by Picosecond UV Laser Ablation
Student Poster Session 4 Q&A
Power Electronics
20. Haksun Lee: Modeling and design of 3D, 2l-Level Stacked SiC Half-Bridge Module for 50kW VSI
21. Hakki Torun: Machine Learning for high-density 50kW SiC Voltage Source Inverter Package Design
22. Jiaxiong Li: High Temperature, High Voltage and High Thermal Epoxy Molding Compounds
23. Ryan Wong: Copper-Graphene Foams and their Composites for Reliable Integrated Cooling in Advanced VSI Packages
24. Mete Muslu: Vertically-Integrated Power Delivery and Thermal Management in SiC Drive Inverter Packages
Student Poster Session 5 Q&A
Wireless
5G
25. Tong-Hong Lin: 5G UWB Package-Integrated Antenna Array
26. Lakshmi Narasimha: Modeling, Design and Fabrication of Miniaturized, High Performance and Integrated Passive Components for 5G and mm-wave Applications
27. Atom Watanabe: Ultra-Thin Antenna-Integrated 3D Glass-Based Millimeter-Wave Package
28. Tailong Shi: Design and Demonstration of Ultra-Thin, High-Performance Glass Panel Embedded (GPE) Packages for mmWave Applications
29. Sridhar Sivapurapu: Flex on Glass for mmWave Applications
6G
30. Kai-Qi Huang: mm-Wave and sub-Terahertz Antennas
31. Mutee Ur Rehman: Broadband Characterization of Glass substrates for mmWave Applications
32. Serhat Erdogan: Design of D-band Glass-based Yagi Antennas
33. Nithin Nedumthakady: Electrodeposited Cu-Graphene Heat Spreaders for Reliable Thermal Management of Embedded Dies
34. Xiaofan Jia: Design and Application for Conductor Backed Dielectric Waveguide on Glass Substrates
35. Lydia Mele: Vapor Chamber for mmWave Infrastructure Applications
36. Nahid Aslani Amoli: Characterization of Alumina Ribbon Ceramic (ARC) Substrate for 5G mm-Wave Applications
Student Poster Session 7 Q&A