Laboratory Capabilities

SOP Substrate & Systems Integration Lab

This is a class 1,000 clean room facility maintained at 68F and relative humidity of 35%. This test bed and prototype research laboratory enables the processing of up to 300 mm substrates and interposers made of organics, glass, flex, ceramics, and silicon with dielectrics build up, via formation and metallization for high density wiring (HDW), and actives and passives embedding for heterogenous integration. Process capabilities in this laboratory include substrate cleaning and preparation, polymer deposition of wet films through spin coating, polymer deposition of dry films through roll or vacuum lamination, soft bake and final film curing, laser via drilling, full field photolithography for feature development, develop, etch and strip of resists and PIDs, feature inspection and characterization, both electrolytic and electroless copper plating for build-up, and gold, nickel and solder plating for surface finish. Equipment includes:

Figure 1: PRC Substrate, Assembly, and Reliability Testing Facilities

Design and Characterization

PRC Computational laboratory consists of a computer cluster with multiple cores and several desktop computers. The computers are loaded with the latest design software such as ADS, Momentum, Ansys, HSpice, Matlab, CST, APD, Allegro and Sonnet. Two measurement laboratories are available, one located in the Klaus Building and the other in the Georgia Electronic Design Center (GEDC). The Klaus facility supports Mixed-mode S-parameters VNA 4-port (40 GHz), Time domain reflectometer (TDR) and TDT (8-Channel), Large area test probe station (3-D), 6-inch Probe-station (2-D), Digital sampling oscilloscope (80 GHz), Spectrum analysis with phase noise measurements (30 GHz), Near field measurements for EMI (3 GHz) and LCR Analyzer (30 MHz). This enhanced through the GEDC facility for measurements from 1GHz to 170GHz.

Broadband Millimeter Wave Set Up (100MHz to 110GHz)

Anritsu VNA (ME7808) and frequency extenders 3742A-EW supports measurement of all the scattering parameters from 100MHz to 110GHz. Cascade MicroTech ACP-110-GSG-200 probes are commonly used for on-wafer measurements along with LRRM calibration using standard calibration substrate provided from Cascade and WinCal XE software. The Broadband measurement set up is shown in Figure 2.

Figure 2: Broadband Measurement Setup (a) VNA with Extenders and Probes (b) TV and Probes (c) ACP110 probe with 200um GSG Pitch

D-band (110GHz to 170GHz) Measurement Set Up

Agilent E8361C vector network analyzer along with millimeter wave controller and extenders (V06VNA2), is supported to measure in the D-band (110-170 GHz). The probes used for D-band are 170-S-GSG-75-BT by Cascade. LRRM calibration can be performed using WinCal XE software to remove the losses from cables, test head and probes. The measurement set up is shown in Figure 3.

Figure 3: D-band Measurement Set up (a) VNA with Extenders and Probes (b) Cascade Infinity Probe with 75um GSG Pitch

PRC Assembly and Environmental Testing Facility

The facility is located in a number of lab spaces within the Pettit building at Georgia Tech.  The facility supports interconnection research and characterization to include wire bonding, flip chip bonding, screen printing and reflow soldering.  There is a mix of semiautomated and manual capabilities within the toolset to enable research and process development in the packaging area at Georgia Tech.  The chip assembly and screen-printing capabilities are in a class 1000 cleanroom bay to enable to use of semiconductor devices and fine line interconnects without contamination.  The coarser or less sensitive process capabilities are in labs 160 and 162.  Characterization toolsets are supplemented by capabilities across other labs within the shared user facilities.  Electronics packaging specific testing capabilities are included in these labs: scanning acoustical microscopy, xray inspection, peel testing, bond testing and electrical characterization.  The environmental testing facility consists of extended testing in chambers for thermal shock, thermal cycling, and high temperature storage.  These processes can all accept device under test measurement or voltage / current application during testing.  An updated list of tools can be found at the link below and includes access requirements for external campus and industry users.