Session I
Welcome Address from IEN – Professor Oliver Brand, IEN Director
PRC Overview – Madhavan Swaminathan, PRC Director
Session II: Design for AI & HPC Systems
Professor Sungkyu Lim – Glass Interposer Integration of Logic and Memory Chiplets: PPA Benefits Over Other Means
Student Poster Session:
Eric Huang – Spherical Harmonic based RCS Compression through Anisotropic Point Scatterer Model
Mercy Daniel Aguebor – Design Considerations for Interposer Fabrication
Seunghyup Han – PDN Optimization with Power Supply Noise Reduction
Osama Bhatti – Inverse Design of Power Delivery Networks using Invertible Neural Networks
Rakesh Krishna – Design optimization of Optical Polymer Interconnects
Pruek Vanna-iampikul – Glass Interposer Integration of Logic and Memory Chiplets: PPA Benefits Over Other Means
Session III: Process for High Density Interposers
Professor Mark Losego: Opportunities for Vapor Modification of Materials for Microelectronics Packaging
Dr. Mohan Kathaperumal – Advances in the fabrication of High-Density Interconnect RDL for Glass Packaging
Student Poster Session:
Pratik Nimbalkar – Novel zero side-etch barrier process for fine line RDL
Christopher Blancher – 8 Metal Layer on Glass Process Optimization
Pragna Bhaskar – Optimizing dose-focus for 1 micron L/S: A FIB-SEM study
Sai Ambi Venkataramanan – Nanoscale Adhesion Promoters for Direct Ti/Cu metallization on Glass Substrates
Jose Lopez-Ninantay – Optical polymer materials for low-loss photonic waveguide interconnects on glass substrates
Session IV: Industry Panel
Panelists: Steven Verhaverbeke (AMAT), Kuldip Johal (Atotech), Martin Letz (Schott), C. G. Zhuang (Corning)
Session V: Power Delivery, Distribution & Thermal for Computing
Professor Yogendra Joshi – Heterogeneous Integration Driven Thermal Management Research at the Packaging Research Center
Prahalad Murali and Venkatesh Avula – Embedded Magnetic Core Inductors for Integrated Voltage Regulators
Student Poster Session:
Prahalad Murali – Embedded Magnetic Core Inductors – Materials and Processes
Mete Muslu – Vertically-Integrated Power Delivery and Thermal Management in SiC Drive Inverter Packages
Lydia Mele Baptist- Vapor Chambers for mmWave Infrastructure Applications
Venkatesh Avula – Package-integrated Thermal Management for Embedded Passives
Session VI: Materials & Assembly
Professor CP Wong – High Performance Epoxy Materials with High Tg and High Breakdown Voltage for next Generation of High-Power Electronics
Jack Moon – Materials and Assembly for Fine Pitch Interconnection and Package Reliability
Student Poster Session:
Ramon Sosa – Cu Pillars with Nanoporous-Cu Caps for C2S Cu-Cu Bonding
Zhijian Sun – High Thermal Conductivity and Electric Insulation Epoxy Composites for 3D packaging
Jiaxiong Li – High Performance Epoxy Molding Compound for High Power Packaging
Amiri Savage – Thermo-Mechanical Reliability of Flip Chip on Glass for Space Applications
Nithin Nedumthakady – High-Performance Cu-Gr Heat Spreaders for Reliable Thermal Management of Embedded Dies
Alex Moss – Copper-Graphene composite wicks in vapor chamber systems for Power Electronics
Session VII: Industry Presentations
Qorvo SHIP-RF Overview: A Heterogeneous Integration Prototyping Facility – Andrew Ketterson, Qorvo
Session VIII: Wireless Technologies for 5G & 6G
Kai-Qi Huang and Xiaofan Jia – Highly Miniaturized Functional Integrated Modules for mmWave Communication
Student Poster Session:
Nahid Aslani Amoli – Design & Demonstration of Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Applications
Sridhar Sivapurapu – Flex on Glass for mmWave and RF Applications
Lakshmi Narasimha Vijaykumar – Design and Modelling of Via-less Interconnects and Slot Antennas using Substrate Integrated Waveguides
Yuqi Liu – Antenna-in-Package Design for mm-Wave 5G Transceiver Array on Glass
Kai-Qi Huang – Sub-Terahertz Antenna in Package
Mutee Ur Rehman – Substrate Integrated RF Waveguides
Serhat Erdogan – Antenna-in-Package for 6G
Xiaofan Jia – Dielectric Waveguide and RF Chip Embedding on Glass Substrate
Joon Woo Kim – Thermal management solutions for Advanced Glass Panel Embedded die Packaging/Heterogenous Integration
Xingchen & Aadit Pandey – RF Chip Embedding on Glass Interposer for 5G Applications