Georgia Institute of Technology
Spring 2020 IAB Presentations
Packaging Research Center Program
Member Resources
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PRC IAB May 20 and 21, 2020
Wednesday, May 20, 2020 Session 1
-Welcome and Overview – Madhavan Swaminathan
-Glass Packaging Technologies for Computing – Highlights & Future Directions – Mohan Kathaperumal
-1 Micron and Beyond RDL – Bartlet Deprospo
-1um Microvia with 8um Pitch by Picosecond UV Laser Ablation: Feasibility Studies – Fuhan Liu
-Power Electronics Packaging Technologies – Highlights and Future Directions – Vanessa Smet
-Embedded Toroidal Inductors for High-Frequency 48V to 1V & 12V to 1V Integrated Voltage Regulator – Claudio A. Alvarez
-Machine Learning for Material & Geometry Co-Optimization for 100kW In-Wheel Inverter Packages – Hakki M. Torun
-Summary – Madhavan Swaminathan (Video Recording)
-Industry Feedback Computing (Video Recording)
-Industry Feedback – Power (Video Recording)
Thursday, May 21, 2020 Session 2
-Wireless Technologies – Highlights & Future Directions – Madhavan Swaminathan
-Ultra-Thin Antenna-Integrated 3D Glass-Based Millimeter-Wave Package – Atom Watanabe
-Modeling, Design and Fabrication of Miniaturized, High Performance and Integrated Passive Components for 5G and mm-wave Applications – Muhammad Ali
-Thermal Management for Emerging Power Electronics and Heterogeneous Integration of Power Delivery – Yogendra Joshi
-Sintered Nanoporous Copper Die-attach Interconnections – Kashyap Mohan
-High-speed low-power optical interconnects for Glass Interposers – Ali Adibi
-Summary & Wrap Up – Madhavan Swaminathan (Video Recording)
– Industry Feedback Wireless (Video Recording)
– Industry Feeback Technology (Video Recording)
Poster Session
AI/HPC
1. Hakki Torun, High-Speed Bus Physical Design Analysis through Machine Learning
2. Majid Ahadi, High-speed channels analysis and design with machine learning
3. Bartlet Deprospo, 1 Micron and Beyond RDL
4. Shreya Dwarakanath, Ultra-Low K Polymer Thin-Film Dielectrics for Low-Latency Wide I/O RDL
5. Pratik Nimbalkar, 2.5D Glass Interposer BGA Package with 2 µm Multi-layer RDL
6. Siddharth Ravichandran, 2.5D and 3D Glass Panel Embedding for High-Performance Computing
7. Omkar Gupte, Design and demonstration of socketable BGAs by surface modification of solder spheres
8. Ramón Sosa, High-throughput, fine pitch all-Cu interconnections for C2S applications
Power Electronics
9. Haksun Lee, Design and Demonstration of 3D Stacked SiC Power Module with Improved Electrical Parasitics, and Thermal and Reliability Performances
10. Hakki Torun, Machine Learning for 100kW In-Wheel Inverter Package Design
11. Claudio Alvarez, Embedded Toroidal Inductors for High-Frequency 48V to 1V & 12V to 1V Integrated Voltage Regulator
12. Srinidhi Suresh, Substrate-Embedded Magnetic Core Toroid Inductors for Integrated Voltage Regulators
13. Mercy Daniel-Aguebor, High-Density, Ultra-Thin Capacitors for Integrated Voltage Regulators
14. Venkatesh Avula, Package-integrated Thermal Management for Embedded Passives
15. Jiaxiong Li, High Temperature, High Voltage and High Thermal Epoxy Molding Compounds
16. Kashyap Mohan, Sintered Nanoporous Copper Die-attach Interconnections
17. Ryan Wong, Graphene Foams and Composites for Integrated Cooling in Power Inverters
18. Seunghyup Han, PDN Optimization with Power Supply Noise Reduction
19. Osama Bhatti, Design Space Exploration using Neural Networks
20. Mete Muslu, Integrated Cooling in SiC-based drive inverters for next-gen Evs
Wireless
21. Kai-Qi Huang, mm-Wave and sub-Terahertz Antennas for 5G and 6G Applications
22. Tong-Hong Lin, 5G UWB Package-Integrated Antenna Array
23. Mutee Ur Rehman, Substrate Integrated RF Waveguides For Sub-THZ Modules
24. Serhat Erdogan, Design of D-band Glass-based Endfire Antennas for 6G Applications
25. Muhammad Ali, Modeling, Design and Fabrication of Miniaturized, High Performance and Integrated Passive Components for 5G and mm-wave Applications
26. Tailong Shi, Design and Demonstration of Ultra-Thin, High-Performance Glass Panel Embedded (GPE) Packages for mmWave Applications
27. Atom Watanabe, Ultra-Thin Antenna-Integrated 3D Glass-Based Millimeter-Wave Package
28. Nithin Nedumthakady, Modeling, Design, and Fabrication of Mechanically Reliable and Near-Zero Thermal Resistance Materials and Processes for Thermal Interface Materials and Heat Spreaders in High-Heat Flux, Embedded-Die Applications
29. Xiaofan Jia, Design and Application for Conductor Backed Dielectric Waveguide
30. Lydia Mele, Vapor Chamber for mmWave 5G & 6G Infrastructure
Emerging Technologies
31. Zhijian Sun, Thin Die Attach Film with High Thermal Conductivity
32. Rakesh Krishna V, Fundamental limits of Optical Interconnection for Chip-to-chip Communications
33. Rui Zhang, High Density Optical and Electrical Interconnects on glass interposers for AI/HPC
34. Sridhar Sivapurapu, Flex on Glass for mmWave Applications
35. Fuhan Liu, Sub-THz Wireless Modules using Organic Substrates
ECTC 2020 Presentation Recordings
-Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and pitch of 10-um using low-k Dielectrics – Fuhan Liu
-Glass-based IC-Embedded Antenna-Integrated Packages for 28-GHz High-speed Data Communications – Atom Watanabe
-W-Band and D-Band Transmission Lines on Glass Based Substrates for Sub-THz Modules – Mutee Ur Rehman
-Fabrication and Reliablity Demonstration of 5um Redistribution Layer using Low-stress Dielectric Dry Film – Pratik Nimbalkar
-Intelligent Digital & RF Convergence for AI – Madhavan Swaminathan
-Heterogeneous Integration of 5G and Millimeter-Wave Diplexers and 3D Glass Substrates – Muhammad Ali
-Design and Demonstration of Single and Coupled Embedded Toroidal Inductors for 48V to 1V Integrated Voltage Regulators – Claudio Alvarez
-Advanced Low Loss Dielectric Material Reliability and Filter Characteristics at High Frequency for mmWave Applications – Takenori Kakutani
-Large-body-sized Glass-based Embedded Interposer for High-Performance Computing – Siddharth Ravichandran
-Synthesis of Boron Nitride Coated Silica Filler for Preparing Thermally Conductive Epoxy Composites – Jiaxiong Li