Session I
Introduction – Madhavan Swaminathan, PRC Director
Welcome – Steven W. McLaughlin, Provost, GT
Welcome – Chaouki Abdallah, EVPR, GT
Welcome and PRC Transition Plans – Oliver Brand, Director, IEN GT
PRC Overview – Madhavan Swaminathan, PRC Director
Keynote: RF Heterogeneous Integration using Photosensitive Glass Ceramics, Jeb H. Flemming, CTO, 3DGS
Session II: Wireless Technologies for 5G & Beyond
Chairs: Sophia Madelone and Yifan Wang
Antenna Integration in Glass Interposers, Serhat Erdogan & Lakshmi Narasimha, ECE
Student Poster Session and Q&A
Overview, Strategy, Technical Approach and Summary – Xiaofan Jia, PhD Student
- Nahid Aslani Amoli: Demonstration and Characterization of Diplexers, Couplers, and IPDs on Alumina Ribbon Ceramic Substrates for 5G NR Bands
- Lakshmi Narasimha Vijaykumar: Design and Modelling of interconnects and antenna arrays on glass
- Kai-Qi Huang: Sub-Terahertz Antenna in Package
- Mutee Ur Rehman: Substrate Integrated Waveguides
- Xiaofan Jia: Planar Goubau Line and Chip Embedded Package for D-Band Applications
- Xingchen Li: RF Chip Embedding on Glass Interposer for 5G Application
Industry Feedback – Moderator: Martin Letz, Schott
Session III: High Density Interposers
Chairs: Oluwaseyi Akinwande and Seunghyup Han
Ultra-low-k dielectrics for high-bandwidth package substrates, Pratik Nimbalkar, Pragna Bhaskar, and Mohan Kathaperumal, PRC Students & Research Faculty, PRC
Student Poster Session and Q&A
Overview, Strategy, Technical Approach and Summary – Mohan Kathaperumal, Research Faculty, PRC
7. Pratik Nimbalkar: Electrical reliability of 1 um RDL
8. Christopher Blancher: Lithography and TGV Processes for Multilayer Test Vehicle
9. Pragna Bhaskar: Electrical characterization and CTE measurement of ultra-low-k dielectric films
10. Sai Ambi Venkataramanan: Surface homogeneity of nanofilms and plasma chemistry optimization for micro via etching
Industry Feedback, Jobert Van Eisden, Atotech
Session IV: Industry Panel
PRC Last Four Years – Industry Perspective; Moderator: Steven Verhaverbeke (Applied Materials)
Martin Letz (Schott)
Andrew Ketterson (Qorvo)
Kimiyuki Kanno (JSR)
Jobert Van Eisden (Atotech)
Session V: CHIPS ACT & Workforce Development
The Way FORWARD: Plotting Pathways for Emerging Technology through Workforce Training, Arthur Evans and Tavarez Holston, Dean and President, Georgia Piedmont Technical College
Session VI: Materials for Power Delivery, Photonics and Harsh Environment
Chairs: Yiliang Guo and Pragna Bhaskar
Hybrid Bonding Technologies for Low Temperature Fine Pitch (<10 µm) Interconnects in 3D Architectures – Janagama Goud & Jack Moon, Research Faculty, PRC
Student Poster Session and Q&A
Overview, Technical Approach, Summary – Mohan Kathaperumal and Jack Moon, Research Faculty, PRC
11. Jose Lopez Ninantay: Characterization of polymer waveguide materials
12. Prahalad Murali: Embedded Magnetic Core Inductors – Materials and Processes
13. Rakesh Krishna: Performance evaluation of the polymer waveguides on glass
14. Jiaxiong Li: High performance epoxy molding compound for high power packaging
15. Pavithra Priyadarshini Kuppakone: Chip-to-substrate polymer-to-polymer hybrid bonding for fine-pitch interconnections
16. Serhat Erdogan: Broadband Characterization of Chip-to-Package Interconnects in Die-Embedded Glass Interpose
Industry Feedback – Moderator: Steven Verhaverbeke, Applied Materials
Nov 18, 2022
Keynote: Machine Learning (ML) Based Design of Terabyte/s Bandwidth 3D Semiconductor Systems for Artificial Intelligence (AI), Joungho Kim, Professor, KAIST
Path Forward, Muhannad Bakir, PRC Interim Director, Professor, ECE
Session VII: Design of AI & HPC Systems
Chairs: Nikhil Damani and Nithin Nedumthakady
Photonics Integration – The Future of Packaging – Ali Adibi, Professor, ECE
Student Poster Session and Q&A
Overview, Technical Approach, Summary – Rahul Kumar, Research Faculty, PRC
- Eric Huang: RCS compression through anisotropic point scatterer model
- Mercy Daniel Aguebor: Design Considerations for Interposer Fabrication
- Osama Bhatti: Inverse Design of Power Delivery Networks using Invertible Neural Networks
- Pruek Vanna-iampikul: Glass Interposer Integration of Logic and Memory Chiplets: PPA Power/Signal Integrity Benefits
- Oluwaseyi Akinwande: Inverse Design of High-Speed Channel
- Yiliang Guo: Machine Learning for Rapid Assessment of EM Response
- Seunghyup Han: PDN Optimization with Power Supply Noise Reduction
24. Yifan Wang: WLP Based Finite Difference Time Domain Method for Fast EM Response Simulation
Industry Feedback – Moderator: Andrew Ketterson, Qorvo
Session VIII: Assembly, Reliability & Thermal Management
Chairs: Xiaofan Jia and Pratik Nimbalkar
Assembly and Reliability of High-Performance Glass Packages, Vanessa Smet, Assistant Professor, ME
Student Poster Session and Q&A
Overview, Technical Approach Summary – Jack Moon, Research Faculty, PRC
25. Joon Woo Kim: Thermal Management Solutions for Advanced Glass Panel Embedded Die Packaging/Heterogeneous Integration 26. Venkatesh Avula: Package-integrated Thermal Management for Embedded Passives
27. Ahmet Mete Muslu: Vertically Integrated Power Delivery and Thermal Management in SiC Drive Inverter Package
28. Yongwon Lee: Thermo-Mechanical Reliability of Flip-Chip on Glass for Space Applications
29. Zhijian Sun: High thermal conductivity epoxy composites for 3D semiconductor packaging
30. Ramon Sosa: Reliability assessment of Cu-pillar interconnections with sintered nanoporous-Cu caps
31. Nithin Nedumthakady: Synthesis, Characterization, and Implementation of Magneto-Electrodeposited Cu-Gr Composites as High-k, Stress-Reducing Conductors
32. Alex Moss: High-performance copper-graphene composite foams for vapor chambers
Industry Feedback – Moderator: Kirk Christiansen, Rogers Corporation
PRC Tour – Lila Dahal, PRC Facilities Manager