IAB Fall ’19 Recordings

Georgia Institute of Technology

Fall 2019 IAB Presentations

Packaging Research Center Program
Member Resources

All information and files on these pages are confidential. Do not distribute or modify.

-Agenda PDF

– Poster Slides at bottom of this page –

Nov 7, 2019

8:00am – 8:45am: Breakfast & Registration

8:45am – 9:00am: Welcome Remarks – Eric Vogel, IEN

9:00am – 9:45am: Keynote: Spacecraft & 3D Packaging Technologies: Infusion and Opportunity – Douglas Sheldon, JPL

9:45am – 10:30am: Welcome & PRC Overview – Madhavan Swaminathan

10:30am – 10:45am: Coffee Break and Photo

Session I: AI and High Performance Computing (Chair: Shreya Dwarakanath, PhD Student, GT)

10:45am – 11:00am: Heterogeneous Integration for AI – Hakki Torun & Saibal Mukhopadhyay

11:00am – 11:15am: Glass Packaging Technology: Status & Update – Mohan Kathaperumal

11:15am – 11:30am: High Aspect Ratio Through Glass Vias (TGV) – Rui Zhang

11:30am – 11:50am: Advanced Panel RDL Technologies for High Performance Computing (HPC) Applications – Bart Deprospo

11:50am – 12:05pm: Cu Pillar with Nanoporous-Cu Caps: Technology Status – Antonia Antoniou

12:05pm – 12:20pm: 2.5D Glass Interposer Application Test Vehicles: Status – Pratik Nimbalkar & Omkar Gupte

12:20pm – 12:35pm: 1 Slide presentation for each poster to introduce topic

12:35pm – 1:35pm: Lunch

1:35pm – 3:05pm: Poster Session by Students & Industry (AI & HPC) (Chair: Ryan Wong, MS Student, GT)

3:05pm – 3:20pm: Industry Feedback, Moderator: Martin Letz, Schott AG

Session II Power Electronics: Computing & Automotive (Chair: Venkatesh Avula, PhD Student, GT)

3:20pm – 3:35pm: Inductor & power-stage co-design for IVRs – Claudio Alvarez

3:35pm – 3:50pm: Substrate-embedded, magnetic core inductors for IVRs – Srinidhi Suresh

3:50pm – 4:05pm: Integrated high-density Capacitors for next-generation voltage regulators – Himani Sharma

4:05pm – 4:20pm: SiC-based Power Electronics for EV Drive: Introduction – Vanessa Smet

4:20pm – 4:35pm: Design & Demonstration of 3D Stacked Rectifier Module – Haksun Lee

4:35pm – 4:50pm: Machine Learning for 100kW SiC In-Wheel Inverter Package Design: Project Introduction – Hakki Torun & Ryan Wong

4:50pm – 5:05pm: 1 Slide presentation for each poster to introduce topic

5:05pm – 6:05pm: Poster Session (Power Electronics) (Chair: Majid Ahadi, PhD Student, GT)

6:05pm – 6:20pm: Industry Feedback, Moderator: Mario Pelella, On-Semi

6:30pm – 9:00pm: Dinner

Nov 8, 2019

 

8:45am – 9:30am: Breakfast & Registration

9:30am – 10:10am: Keynote: Integration Challenges for WBG Power Device Packaging – Shailesh Joshi, Toyota

10:10am – 10:25am: PRC Membership & Structure – Dean Sutter

Session III 5G & 6G Wireless (Chair: Serhat Erdogan, PhD Student, GT)

10:25am – 10:40am: Design & Demonstration of Ultra-thin 3D Glass-based Antenna-integrated mm-wave Modules – Atom Watanabe

10:40am – 10:55am: Design & Demonstration of Integrated Passive Components Test Vehicle for 5G and mm-wave Applications – Muhammad Ali

10:55am – 11:10am: Coffee Break

11:10am – 11:25am: UWB 5G Package-Integrated Antenna Array Design – Tong-Hong Lin & Manos Tentzeris

11:25am – 11:45am: Signaling & Packaging for sub-THz Applications – Microstrips, CPWs and SIWs – Siddharth Ravichandran & Mutee Ur Rehman

11:45am – Noon: Thermal Management for 6G Module Using Vapor Chamber – Nahid Amoli

Noon – 12:15pm: 1 Slide presentation for each poster to introduce topic

12:15pm – 1:15pm: Boxed Lunch

1:15pm – 2:15pm: Poster Presentation by Students & Industry (5G & 6G) (Chair: Osama Waqar Bhatti, PhD Student, GT)

2:15pm – 2:30pm: Industry Feedback, Moderator: Christian Hoffman, Qualcomm

Session IV: Emerging Technologies (Chair: Madhavan Swaminathan, GT)

2:30pm – 2:45pm: Sub-THz Wireless Modules using Organic Substrates – Fuhan Liu

2:45pm – 3:00pm: Flex on Glass for mmWave Applications – Sridhar Sivapurapu

3:00pm – 3:15pm: Photonics in the Package for Extreme Scalability in Heterogeneous Systems – Ali Adibi

3:15pm – 3:30pm: Industry Feedback, Moderator – Madhavan Swaminathan, GT

3:30pm – 4:00pm: Wrap Up

4:00pm – 5:00pm: IEN & PRC Facilities tour – Chris White & Lila Dahal (sign-up Nov 7 at registration)

4:00pm – 6:00pm: One-on-One Meetings with industry – Contact Carol Mills (carol.mills@ien.gatech.edu)

 

Poster Slides

 

Nov. 7 Session I 1:35pm – 3:05pm: Poster Session by Students & Industry (AI & HPC) (Chair: Ryan Wong, MS Student, GT)

 

Nov. 7: Session II 5:05pm – 6:05pm: Poster Session by Students (Power Electronics) (Chair: Majid Ahadi, PhD Student, GT)

November 8: Session III 1:15pm – 2:15pm: Poster Presentation by Students and Industry (5G & 6G) (Chair: Osama Waqar Bhatti, PhD Student, GT)