Georgia Institute of Technology
Fall 2019 IAB Presentations
Packaging Research Center Program
Member Resources
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– Poster Slides at bottom of this page –
Nov 7, 2019
8:00am – 8:45am: Breakfast & Registration
8:45am – 9:00am: Welcome Remarks – Eric Vogel, IEN
9:45am – 10:30am: Welcome & PRC Overview – Madhavan Swaminathan
10:30am – 10:45am: Coffee Break and Photo
Session I: AI and High Performance Computing (Chair: Shreya Dwarakanath, PhD Student, GT)
10:45am – 11:00am: Heterogeneous Integration for AI – Hakki Torun & Saibal Mukhopadhyay
11:00am – 11:15am: Glass Packaging Technology: Status & Update – Mohan Kathaperumal
11:15am – 11:30am: High Aspect Ratio Through Glass Vias (TGV) – Rui Zhang
11:50am – 12:05pm: Cu Pillar with Nanoporous-Cu Caps: Technology Status – Antonia Antoniou
12:20pm – 12:35pm: 1 Slide presentation for each poster to introduce topic
12:35pm – 1:35pm: Lunch
1:35pm – 3:05pm: Poster Session by Students & Industry (AI & HPC) (Chair: Ryan Wong, MS Student, GT)
3:05pm – 3:20pm: Industry Feedback, Moderator: Martin Letz, Schott AG
Session II Power Electronics: Computing & Automotive (Chair: Venkatesh Avula, PhD Student, GT)
3:20pm – 3:35pm: Inductor & power-stage co-design for IVRs – Claudio Alvarez
3:35pm – 3:50pm: Substrate-embedded, magnetic core inductors for IVRs – Srinidhi Suresh
4:05pm – 4:20pm: SiC-based Power Electronics for EV Drive: Introduction – Vanessa Smet
4:20pm – 4:35pm: Design & Demonstration of 3D Stacked Rectifier Module – Haksun Lee
4:50pm – 5:05pm: 1 Slide presentation for each poster to introduce topic
5:05pm – 6:05pm: Poster Session (Power Electronics) (Chair: Majid Ahadi, PhD Student, GT)
6:05pm – 6:20pm: Industry Feedback, Moderator: Mario Pelella, On-Semi
6:30pm – 9:00pm: Dinner
Nov 8, 2019
8:45am – 9:30am: Breakfast & Registration
9:30am – 10:10am: Keynote: Integration Challenges for WBG Power Device Packaging – Shailesh Joshi, Toyota
10:10am – 10:25am: PRC Membership & Structure – Dean Sutter
Session III 5G & 6G Wireless (Chair: Serhat Erdogan, PhD Student, GT)
10:55am – 11:10am: Coffee Break
11:10am – 11:25am: UWB 5G Package-Integrated Antenna Array Design – Tong-Hong Lin & Manos Tentzeris
11:45am – Noon: Thermal Management for 6G Module Using Vapor Chamber – Nahid Amoli
Noon – 12:15pm: 1 Slide presentation for each poster to introduce topic
12:15pm – 1:15pm: Boxed Lunch
1:15pm – 2:15pm: Poster Presentation by Students & Industry (5G & 6G) (Chair: Osama Waqar Bhatti, PhD Student, GT)
2:15pm – 2:30pm: Industry Feedback, Moderator: Christian Hoffman, Qualcomm
Session IV: Emerging Technologies (Chair: Madhavan Swaminathan, GT)
2:30pm – 2:45pm: Sub-THz Wireless Modules using Organic Substrates – Fuhan Liu
2:45pm – 3:00pm: Flex on Glass for mmWave Applications – Sridhar Sivapurapu
3:15pm – 3:30pm: Industry Feedback, Moderator – Madhavan Swaminathan, GT
3:30pm – 4:00pm: Wrap Up
4:00pm – 5:00pm: IEN & PRC Facilities tour – Chris White & Lila Dahal (sign-up Nov 7 at registration)
4:00pm – 6:00pm: One-on-One Meetings with industry – Contact Carol Mills (carol.mills@ien.gatech.edu)
Poster Slides
Nov. 7 Session I 1:35pm – 3:05pm: Poster Session by Students & Industry (AI & HPC) (Chair: Ryan Wong, MS Student, GT)
- Hakki Torun, Convolutional Networks for Co-Optimization of IVR and Embedded Inductor for 2.5D Packaging
- Huan Yu, Behavioral Modeling of I/O Drivers Using Neural Networks
- Majid Ahadi, Jitter and Eye Estimation in High-Speed Channels.
- Kallol Roy, Inverse Design of Transmission Lines with Deep Learning
- Ningyuan Cao, A 65nm 1.1-9.1TOPS/W Hybrid-Digital-Mixed-Signal Computing Platform for Accelerating Model- Based and Model-Free Swarm Robotics
- Heechun Park, RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICs
- Jinwoo Kim, Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse
- Rui Zhang, High Aspect Ratio TGVs by Femtosecond Laser Drilling
- Shreya Dwarakanath, Ultra Low-K, Ultrathin Polymer Dielectrics for Panel RDL
- Bartlet Deprospo, Modeling, Design and Demonstration of 1µm Low Resistance RDL For High Performance Computing
- Takenori Kakutani (Visiting Engineer, Taiyo), High Reliability Demonstration of 3µm Photo Vias in PID material for 2.5D Glass Interposer Applications
- Pratik Nimbalkar, Design & Demonstration of 2.5D Glass Interposer BGA package with 2um Multi-layer RDL
- Siddharth Ravichandran, 2.5D and 3D Glass Panel Embedding (GPE) for High Performance Computing
- Ramón Sosa, Direct Cu-Cu bonding in C2S applications using Cu pillar with nanoporous copper caps
- Omkar Gupte, Fabrication, attachment and characterization of solder spheres with multilayered thin-film coatings for socketing and surface mount applications.
Nov. 7: Session II 5:05pm – 6:05pm: Poster Session by Students (Power Electronics) (Chair: Majid Ahadi, PhD Student, GT)
- Seunghyup Han, Analysis of Maximum Voltage Droops in Power Delivery Networks
- Osama Bhatti, Impedance Response Extrapolation of PDNs using Recurrent Neural Networks
- Claudio Alvarez Embedded inductors and Power Stage Co-Design for 48V to 1V Integrated Voltage Regulators
- Srinidhi Suresh, Ultra-High Efficiency Substrate-Embedded Inductors for Integrated Voltage Regulators
- Venkatesh Avula, Thermal analysis of integrated voltage regulator
- Mickael Mauger, Soft Switching Current Source Inverter for next-generation Electric Vehicle Drivetrains
- Haksun Lee, Design & Demonstration of 3D Stacked Rectifier Module
- Hakki Torun, Bayesian Learning for Optimization and Analysis of SiC-based Inverter Package
- Ryan Wong, Multiphysics modeling of next-gen SiC-based power cards: integrated cooling
- Jiaxiong Li, High Temperature, High Voltage and High Thermal Conductivity Epoxy Molding Compound
- Kashyap Mohan, Sintered copper die-attach interconnections: shear strength analysis
- Justin Broughton, Additive Manufactured Foams for Power Electronics Thermal Management
- Minxiang Gong, Feasibility of Integrated Single-stage 48V to 1V Conversion using GaN Power Devices
November 8: Session III 1:15pm – 2:15pm: Poster Presentation by Students and Industry (5G & 6G) (Chair: Osama Waqar Bhatti, PhD Student, GT)
- Kai-Qi Huang, mm-Wave and sub-Terahertz Antennas for 5G and 6G Applications
- Mutee Ur Rehman, Substrate Integrated Waveguides for sub-THz Region
- Serhat Erdogan, Design of D-Band Glass-based Vivaldi Antennas for 6G Applications
- Muhammad Ali, Design and Demonstration of Integrated Passive Components Test Vehicle for 5G and mm-wave Applications
- Tong-Hong Lin, UWB 5G Package-Integrated Antenna Array Design
- Tailong Shi, Design and Demonstration of Ultra-thin Glass Panel Embedding Packages for RADAR Applications
- Nahid Aslani Amoli, Thermal Management for 6G Module Using Vapor Chamber
- Atom Watanabe, Design and Demonstration of Ultra-thin 3D Glass-based Antenna-integrated mm-wave Modules
- Sridhar Sivapurapu and Nahid Aslani Amoli, Model Development for Flexible Hybrid Electronics Process Design Kit
- Nithin Nedumthakady – Thermomechanical analysis of GPE packages: integrated heat spreader design for high heat flux densities & reliability
- Xiaofan Jia- Bandpass Filters for D-band Application
- Nobuo Ogura (Visiting Engineer, Nagase), First demonstration of Ultra-Thin Glass Panel Embedded Package with Sheet-type Epoxy Molding Compound